HDI PCB
Engineered for fine-pitch components, compact layouts, and high-density interconnection.
| Layers | Up to 24 |
|---|---|
| Line / space | 0.065 mm minimum |
| Material | FR-4 |
| Surface finish | ENIG |
| Process | Min. finished hole 0.10 mm, aspect ratio 10:1 |
General capability of our current production. Final limits depend on your stack-up and design review.