PCBA Solution
Assembly, component sourcing, and testing on the same inquiry as the bare board.
| Process | SMT (0201 to 45 mm parts, 0.35 mm BGA pitch) and DIP, boards up to 400 × 510 mm |
|---|---|
| Testing | SPI, AOI, X-ray, first article, functional test |
| Components | Full or partial component sourcing |
General capability of our current production. Final limits depend on your stack-up and design review.